CAN 8 × 8 ToF sensor module

Development-stage CAN board for 64-zone radial ranging with the ST VL53L5CX. Engineering firmware and host integration are reported locally tested; physical hardware qualification remains pending.

$159 USD per board assembly. Shipping charged separately.

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Product details

A compact STM32 carrier with one soldered 8 × 8 ToF daughterboard provides 64-zone radial ranging with the ST VL53L5CX. This is a fixed, installed board assembly; the daughterboard is not a user-swappable accessory. The common carrier provides USB-C development access, two connectors on one shared CAN/power bus, selectable termination, and a 20-contact soldered module interface. Daughterboard components face outward on the underside. The gallery shows Blender renders of the October 13 detailed STEP assemblies, with three views of this installed daughterboard. The supplied silkscreen labels and exposed copper artwork are retained, with black soldermask, gold pads and reflective metal surfaces. Internal copper remains behind the opaque board surfaces. Cable mates and wires are omitted. Some components retain simplified envelopes; render materials and highlights are visualization choices. These are CAD renders, not product photographs or qualified clearance drawings. The supplied R1 Family 0.2.0-engineering follow-up reports firmware and host integration implemented and locally tested for this variant. Its family-wide validation report records 77 passing software tests using native mocks and simulated Cyphal nodes; this is not a per-board hardware test count. Physical board testing and ROS 2 runtime validation remain pending. The engineering software includes R1 Sensor Studio for ToF grid and 3D views and CAN network diagnostics. Confirm software delivery, licensing, support and integration requirements with your inquiry.

$159 USD per board assembly. Shipping charged separately. Hardware designs and an engineering software baseline are available for integration review. Physical hardware qualification and ROS 2 runtime validation remain pending. Package contents, software delivery, licensing, support and lead time are confirmed by inquiry.

Ordering
Price	$159 USD per board assembly. Shipping charged separately.

Common carrier
Assembly	One compact carrier with one soldered daughterboard; 20-contact interface carrying power, I²C, SPI and control signals
Processor	STM32G0B1KCU7, Cortex-M0+, 64 MHz; 256 KB flash and 144 KB SRAM
PCB outline	36 × 40 mm including mounting ears; 36 × 26 mm main body. Connectors, components, and cables require additional clearance.
Power design target	9–60 V regulated DC; unqualified. Rail, thermal, startup and transient validation remain open; not a motor-bus surge rating.
Bus connectors	Two Molex Pico-EZmateHC 4-pin connectors on one shared CAN/power bus, not independent CAN channels
Bus pinout	1 CAN_L · 2 CAN_H · 3 GND · 4 VIN_BUS
Termination	Selectable 120 Ω end-of-bus termination via CAN TERM jumper
Development access	USB-C, BOOT and RESET. Follow-up reports a separate Classical CAN SLCAN adapter firmware image for a spare carrier, with daughterboard rails off; physical USB/CAN operation untested.
Qualification	Designed hardware; assembled units and system performance are not yet qualified. CAD images use some simplified component envelopes.

8 × 8 ToF
Sensor	ST VL53L5CXV0GC/1
Measurement	8 × 8 grid / 64 ranging zones; radial distances and per-zone status
Component limits	Up to 4 m under specified sensor conditions; 65° nominal diagonal field of view; up to 15 Hz at 8 × 8. These are sensor limits, not measured R1 board performance.
Software status	R1 Family 0.2.0-engineering reports firmware and host integration implemented and locally tested with mocks/simulation. Physical hardware qualification and ROS 2 runtime validation pending.
ROS 2 source mapping	Engineering bridge source maps DepthGrid, radial-range/status images and diagnostics. ROS 2 runtime validation pending; calibrated point clouds are not included.

Engineering software
Release and test evidence	Supplied family-wide 0.2.0-engineering report lists five compiled STM32 targets and 77 passing software tests. Driver interfaces use mocks; Sensor Studio uses simulated Cyphal nodes. This is reported evidence, not independent hardware verification.
Release limits	Physical MCU/USB/CAN, sensing and power qualification pending; ROS 2 runtime untested. Development USB IDs and unsigned engineering binaries are not a production release. Public licensing and support remain to be confirmed.
Variant interfaces	DepthGrid, radial-range/status images and diagnostics. ROS 2 runtime validation pending; calibrated point clouds are not included.